Technical Specifications

This chapter contains a comprehensive list of the server's technical specifications. Refer to this section for detailed information on supported components, environmental requirements, and regulatory compliance.

CATEGORY	CCOMPONENT	SPECIFICATION
System	Form Factor	2U Rackmount
	Processor	Supports up to 2× Intel® Xeon® Scalable processors (up to 350W TDP)
	Memory	16 × DDR5 RDIMM slots, up to 6400 MT/s, 8-channel per CPU, ECC supported
	Storage Bays	Up to 24 × 2.5” U.2 NVMe hot-swappable drive bays
	Expansion Slots	8 × PCIe Gen5 slots, 2 × OCP NIC 3.0 slots
Motherboard	BMC SoC	ASPEED AST2600
	Management	BMC with IPMI 2.0, Redfish, HTML5 KVM
Power	Power Supply	Dual redundant 2200W /2400W/3200W Titanium-level PSUs
Environment	Operating Temp.	10°C to 35°C (50°F to 95°F)
	Non-Operating Temp.	–20°C to 60°C (–4°F to 140°F)
	Operating Humidity	10% to 90% (non-condensing)

Regulatory compliance statements

This equipment has been tested and found to comply with the limits for a Class A digital device. It is intended for use in commercial, industrial, or business environments.

• FCC (United States): Complies with Part 15 of the FCC Rules.

• CE (Europe): Conforms to EMC Directive 2014/30/EU and Low Voltage Directive 2014/35/EU.

• RoHS: Compliant with the Restriction of Hazardous Substances Directive.